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Applied Materials, BESI Push Die-to-Wafer Hybrid Bonding Toward High-Volume Manufacturing
<p>Applied Materials and BESI debut the Kinex hybrid bonding system for advanced chiplet packaging.</p> <p>The post <a href="https://www.eetimes.com/applied-materials-besi-push-die-to-wafer-hybrid-bon...
At SEMICON Europa this week, Applied Materials and BE Semiconductor Industries (BESI) gathered a small group of journalists for a press briefing on what the companies describe as the industry’s first
Source: EE Times
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Published on 2025-11-22 07:00