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Q.ANT Raises Series A, Debuts Second-Gen TFLN Photonic Chip
The German startup said its ability to accelerate non-linear math helps reduce AI’s energy footprint. The post <a href="https://www.eetimes.com/q-ant-...
Shenzhen Meishilong Electronic Technology Co., Ltd. has bee…
Congratulations to Shenzhen Meishilong Electronic Technology Co., Ltd. for winning the 2025 Growth Star Distributor Award at the 2025 IIC hosted by As...
Mastiska Raises $10M Seed For Sovereign AI Chip Play in UAE
The fledgeling UAE-based chip startup will start with an FPGA-based data center product. The post <a href="https://www.eetimes.com/mastiska-raises-10m...
Silicon Labs Targets India’s IoT Engineers with Studio 6 Ov…
Silicon Labs unveils Simplicity Studio 6, strengthening its India engineering focus with faster IoT development and AI-driven tools. The post <a href=...
GigaDevice Launches GD25NX Series xSPI NOR Flash with Dual-…
GigaDevice launches the new generation of high-performance dual-voltage xSPI NOR Flash products – the GD25NX series, featuring a 1.8 V core and 1.2 V...
A Power Reshuffle Follows GF, TSMC GaN Tie-Up
TSMC licenses GaN tech to GF as it exits, sparking a U.S. shift in power semiconductors. The post A Power Resh...
DARPA Quantum Benchmarking Taps Canadian Firms
Canadian quantum firms Photonic and Xanadu advance in DARPA quantum benchmarking. Who will be the first to reach utility-scale quantum computers? The...
How to Leverage End-to-End PCB Services for Faster Time to …
End-to-end PCB services accelerate market introduction time frames and help clients avoid pitfalls. Learn how to choose a provider and optimize result...
Smarter Silicon with Menta eFPGA and HW/SW Co-Design
Learn how Menta’s eFPGA and HW/SW Co-Design enable 10–100× performance gains, flexibility, and crypto-agility in modern ASICs and SoCs. The post <a hr...
Electronics Technology
VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Pr…
GUC has teamed up with VSORA to offer turnkey ASIC design services, ensuring the tapeout of the Jotunn8 datacenter AI inference processor. The post <a...
Electronics Technology
Cloud-first safety: EB corbos Linux for Safety Applications…
If you build safety-critical software for vehicles, you know the feeling. A design review clears on Tuesday, but the hardware bench is booked for week...
Applied Materials, BESI Push Die-to-Wafer Hybrid Bonding To…
Applied Materials and BESI debut the Kinex hybrid bonding system for advanced chiplet packaging. The post <a href="https://www.eetimes.com/applied-mat...
Why Low-Band Spectrum Remains the Backbone of Mobile Networ…
Low-band spectrum quietly powers global mobile coverage and IoT. The post Why Low-Band Spectr...